Aobayama Campus, Sendai, Japan
The Tohoku University Engineering Summer Program (TESP) is a 16-day international program that brings together engineering students from universities around the world. TESP Winter 2026 combines hands-on experience in Tohoku University laboratories with an entrepreneurship-oriented, project-based learning module.
Working in multicultural teams, participants will explore real-world social challenges, engage in laboratory research, and learn to connect specialized technical knowledge with societal solutions.
The program includes Entrepreneurship Module, Laboratory Activity Module, Field Trip, Japanese language class, Japanese cultural experiences (e.g., kimono dressing, tea ceremony, doll painting), and field trip are included.
Details vary by course. Please refer to each field’s description for specific content.
Participants are responsible for arranging their own accommodation.
Tohoku University support services can assist in finding affordable accommodation options.
110,000 JPY
The program fee covers:
Participants are responsible for their own:
All lectures, activities, and academic components are conducted in English.
A JASSO scholarship (80,000 JPY) is available for 30 selected students from Tohoku University / School of Engineering partner institutions.
ITS Students from all batches
Curriculum Vitae (CV)
Passport information page (valid at least until 1 January 2028)
Student ID scan
Formal photo
Statement Letter – Download here
Motivation Letter (1–2 pages) explaining why you should be selected
Proof of at least 4 mobility Stamp4It, or GCW/GCA/GCW IUP certificate (min. grade C)
Prepare all required documents and combine them into one .zip/.rar file (PDF format only).
Submit your application via https://its.id/studyabroadITS
After submission, send a confirmation email to studyabroad@its.ac.id with the subject:Confirmation Study Abroad Application_TESP_NAME_NRP
Deadline: 17 September 2026 (09.00 WIB)
Online interview: 21 September 2026
For inquiries, email studyabroad@its.ac.id with subject: (ASK)_TESP