Tohoku University Engineering Short Program is a 10-day international program (January 14–23, 2026) designed to inspire future engineers from around the world! Through project-based learning and multicultural teamwork, participants will explore how engineering can drive innovation and social impact. The program features company visits to industry leaders such as Toyota, an entrepreneurship keynote lecture by a startup founder, and opportunities to enhance presentation and problem-solving skills while experiencing Japan’s winter culture.
Join us at Tohoku University’s Aobayama campus for this unique opportunity to collaborate with global peers and create unforgettable winter memories!
ITS Students from all batches
Participants have 2 accommodation options during the program period. Please note that the number of rooms in the university dormitory is limited, and placement in the preferred accommodation cannot be guaranteed.
Check-in date: January 13, 2026 (Tue)
Check-out date: January 24, 2026 (Sat)
Option 1: Hotel Green Mark (Single Room) – 70,000 JPY Conveniently located near Sendai Station and downtown, with comfortable rooms and excellent amenities to enhance your stay.
https://maps.app.goo.gl/LRP8UFA5iJp4UBEYA
Option 2: On-Campus Dorm (Single Room, Shared bathroom/Kitchen) – 40,000 JPY Located at Aobayama Campus with limited room availability (15 rooms: 5 male/10 female).
https://maps.app.goo.gl/LC6TUnePMCPxrd1e7
Field trip to Matsushima, just a 30-minute drive from Sendai. Explore a lively fish market before immersing yourself in the beauty of Matsushima’s temples and scenic landscapes. Enjoy a relaxing boat cruise to Shiogama Port, taking in the unique islands along the way.
Trip destinations are subject to change, and more exciting visits and activities may be added!
35,000 JPY *The program fee covers lectures, cultural activities, and field trips. Daily living expenses are excluded.
More info: here
Program Brochure
Curriculum Vitae (CV)
Passport information page (valid at least until 1 January 2026)
Student ID scan
Formal photo
Statement Letter – Download here
Motivation Letter (1–2 pages) explaining why you should be selected
Proof of at least 4 mobility Stamp4It, or GCW/GCA/GCW IUP certificate (min. grade C)
Prepare all required documents and combine them into one .zip/.rar file (PDF format only).
Submit your application via https://its.id/studyabroadITS
After submission, send a confirmation email to studyabroad@its.ac.id with the subject:Confirmation Study Abroad Application_TESP_NAME_NRP
Confirmation Study Abroad Application_TESP_NAME_NRP
Deadline: 4 November 2025 (09.00 WIB)
Online interview: 6 November 2025
For inquiries, email studyabroad@its.ac.id with subject: (ASK) WinterProgram_TESP
(ASK) WinterProgram_TESP
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