Aobayama Campus, Sendai, Japan
The Tohoku University Engineering Summer Program (TESP) is a 16-day international program that brings together engineering students from universities around the world. Conducted entirely in English, the program combines advanced engineering lectures, hands-on laboratory activities, and rich cultural experiences in Japan.
Each summer, approximately 50 students gather at Tohoku University’s Aobayama Campus to learn, collaborate across disciplines, and build lasting international connections.
The program includes:
Details vary by course. Please refer to each field’s description for specific content.
TESP-Robotics is a two-week summer program designed for graduate students. It offers graduate-level lectures and laboratory-based hands-on activities, taught entirely in English.
The program is delivered by experienced professors from:
Students from Tohoku University will also support participants during the program.
TESP-Materials is a two-week summer program featuring lectures and laboratory activities conducted in English by faculty members from:
Participants will also take part in a bus trip to a research facility or manufacturing site of a private company near Sendai. This course welcomes students and young professionals from partner institutions worldwide who are seeking an intensive and practical engineering experience in Japan.
Participants are responsible for arranging their own accommodation.
Tohoku University support services can assist in finding affordable accommodation options.
90,000 JPY
The program fee covers:
Participants are responsible for their own:
All lectures, activities, and academic components are conducted in English.
A JASSO scholarship (80,000 JPY) is available for 30 selected students from Tohoku University / School of Engineering partner institutions.
ITS Students from all batches
More info: here
Curriculum Vitae (CV)
Passport information page (valid at least until 1 January 2026)
Student ID scan
Formal photo
Statement Letter – Download here
Motivation Letter (1–2 pages) explaining why you should be selected
Proof of at least 4 mobility Stamp4It, or GCW/GCA/GCW IUP certificate (min. grade C)
Prepare all required documents and combine them into one .zip/.rar file (PDF format only).
Submit your application via https://its.id/studyabroadITS
After submission, send a confirmation email to studyabroad@its.ac.id with the subject:Confirmation Study Abroad Application_TESP_NAME_NRP
Confirmation Study Abroad Application_TESP_NAME_NRP
Deadline: 6 April 2026 (09.00 WIB)
Online interview: 8 April 2026
For inquiries, email studyabroad@its.ac.id with subject: (ASK)_TESP
(ASK)_TESP
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